Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009256 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Lung-Kai Mao, Yung-Sheng Lin | 2024-06-11 |
| 11955423 | Semiconductor device and method | Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Hsueh-Sheng Wang | 2024-04-09 |