Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961810 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2024-04-16 |
| 11908818 | Semiconductor device | Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2024-02-20 |