YT

Yu-Jen Tseng

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Baoshan, TW: #69 of 246 inventorsTop 30%
Overall (2024): #199,351 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11961810 Solderless interconnection structure and method of forming same Yu-Wei Lin, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen 2024-04-16