Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942398 | Semiconductor device having at least one via including concave portions on sidewall | Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Chin-Yu Ku | 2024-03-26 |
| 11901266 | Semiconductor device structure and method for forming the same | Ting-Li Yang, Wen-Hsiung Lu, Lung-Kai Mao, Mirng-Ji Lii | 2024-02-13 |