Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2024-11-12 |
| 12119238 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Yu-Peng Tsai +4 more | 2024-07-16 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2024-03-26 |