Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo +2 more | 2024-12-24 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2024-07-16 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2024-05-28 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2024-03-26 |