Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Chih-Chiang Tsao, Hsuan-Ting Kuo, Mao-Yen Chang, Hsiu-Jen Lin +1 more | 2024-10-01 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2024-07-16 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11942464 | Semiconductor package and method | Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2024-03-26 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2024-02-13 |
| 11862577 | Package structure and method of fabricating the same | Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2024-01-02 |