Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12135673 | Baseboard management controller and operation method thereof | Hung Liu | 2024-11-05 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Hsuan-Ting Kuo, Mao-Yen Chang, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2024-10-01 |
| 12051639 | Package structure and manufacturing method thereof | Chao-Wei Chiu, Jen-Jui Yu, Hsiu-Jen Lin, Ching-Hua Hsieh | 2024-07-30 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen +1 more | 2024-07-30 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2024-05-28 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2024-02-13 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo +1 more | 2024-01-16 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2024-01-02 |