Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051639 | Package structure and manufacturing method thereof | Chih-Chiang Tsao, Jen-Jui Yu, Hsiu-Jen Lin, Ching-Hua Hsieh | 2024-07-30 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen +1 more | 2024-07-30 |