Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021037 | Method for manufacturing package structure | Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2024-06-25 |
| 11955460 | Advanced info POP and method of forming thereof | Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng +2 more | 2024-04-09 |