Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2024-06-18 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng +2 more | 2024-04-09 |