Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Chen, Chung-Shi Liu, Jiun Yi Wu, Shou-Yi Wang, Tsung-Ding Wang | 2024-12-31 |
| 12165941 | Semiconductor device and method of manufacture | Chen-Hua Yu, Jiun Yi Wu | 2024-12-10 |
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2024-11-12 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2024-08-27 |
| 12002767 | Integrated circuit package and method | Chung-Shi Liu, Jiun Yi Wu | 2024-06-04 |
| 11984375 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2024-05-14 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2024-04-16 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Hsin-Yu Pan | 2024-02-06 |