Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2024-02-06 |