Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021024 | Semiconductor device including a semiconductor die and a plurality of antenna patterns | Sen-Kuei Hsu, Yi-Che Chiang | 2024-06-25 |
| 12014992 | Semiconductor package | Sen-Kuei Hsu, Chien-Chang Lin | 2024-06-18 |
| 11984372 | Integrated circuit package and method | Teng-Yuan Lo, Lipu Kris Chuang | 2024-05-14 |
| 11942442 | Package structure and manufacturing method thereof | Sen-Kuei Hsu | 2024-03-26 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee | 2024-02-06 |