Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2024-07-30 |
| 12021024 | Semiconductor device including a semiconductor die and a plurality of antenna patterns | Hsin-Yu Pan, Yi-Che Chiang | 2024-06-25 |
| 12014992 | Semiconductor package | Hsin-Yu Pan, Chien-Chang Lin | 2024-06-18 |
| 11942442 | Package structure and manufacturing method thereof | Hsin-Yu Pan | 2024-03-26 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai | 2024-02-06 |