Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125812 | Integrated circuit packages and methods of forming the same | Chien-Yuan Huang, Chuei-Tang Wang, Chen-Hua Yu | 2024-10-22 |
| 12125824 | Semiconductor stack structure and manufacturing method thereof | Chuei-Tang Wang, Chien-Yuan Huang | 2024-10-22 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Tsung-Shu Lin | 2024-05-28 |