Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Yuan Sheng Chiu, Shih-Chang Ku, Tsung-Shu Lin | 2024-05-28 |
HL
Hung-Chi Li
Overall (2024): #439,364 of 561,600Top 80%
1
Patents 2024