Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080623 | Integrated circuit packages having mechanical brace standoffs | Chih-Kai Cheng, Tsung-Shu Lin | 2024-09-03 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin | 2024-05-28 |