Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057406 | Package having redistribution layer structure with protective layer | Chen-Hua Yu, Kuo-Chung Yee | 2024-08-06 |
| 12014993 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2024-06-18 |
| 11961789 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2024-04-16 |
| 11929345 | Semiconductor device including binding agent adhering an integrated circuit device to an interposer | Chen-Hua Yu, Kuo-Chung Yee | 2024-03-12 |
| 11916028 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2024-02-27 |
| 11888285 | Low numerical aperture fiber output diode laser module | Chi-Luen Wang, Hung-Sheng Lee, Tai-Ming Chang, Yu-Ching Yeh, Sheng-Ping Lai +4 more | 2024-01-30 |