Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159862 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Chia-Wei Tu, Yi Wang | 2024-12-03 |
| 11996368 | Pad structure for enhanced bondability | Ru-Ying Huang, Yung Ching Chen, Yueh-Chiou Lin | 2024-05-28 |
| 11959958 | Method of analyzing semiconductor structure | Yi-Min Liu, Chien-Yi Chen | 2024-04-16 |
| 11935760 | Package structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2024-03-19 |