Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996368 | Pad structure for enhanced bondability | Ru-Ying Huang, Yueh-Chiou Lin, Yian-Liang Kuo | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996368 | Pad structure for enhanced bondability | Ru-Ying Huang, Yueh-Chiou Lin, Yian-Liang Kuo | 2024-05-28 |