Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996368 | Pad structure for enhanced bondability | Ru-Ying Huang, Yung Ching Chen, Yian-Liang Kuo | 2024-05-28 |
YL
Yueh-Chiou Lin
Overall (2024): #201,392 of 561,600Top 40%
1
Patents 2024