Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996368 | Pad structure for enhanced bondability | Yung Ching Chen, Yueh-Chiou Lin, Yian-Liang Kuo | 2024-05-28 |
RH
Ru-Ying Huang
Overall (2024): #289,287 of 561,600Top 55%
1
Patents 2024