CT

Chia-Wei Tu

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Zhubei City, TW: #32 of 132 inventorsTop 25%
Overall (2024): #505,515 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12159862 Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices Yian-Liang Kuo, Yi Wang 2024-12-03