Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111582 | Substrate stage and substrate processing system using the same | Yu-Huan Chen, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu | 2024-10-08 |
| 12114411 | Apparatus and method for generating extreme ultraviolet radiation | Yu-Huan Chen, Ming-Hsun Tsai, Shang-Chieh Chien, Heng-Hsin Liu | 2024-10-08 |
| 12113022 | Semiconductor package and manufacturing method of semiconductor package | Ying-Cheng Tseng, Hao-Yi Tsai, Chia-Hung Liu | 2024-10-08 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 12002768 | Semiconductor package and manufacturing method thereof | Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2024-06-04 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |