Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more | 2024-06-04 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2024-03-12 |