Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125810 | Delamination sensor | Ming-Chung Wu, Kuo-Wen Chen, Hsiang-Tai Lu | 2024-10-22 |
| 12100682 | Package structure with conductive patterns in a redistribution layer | Yu-Chia Lai, Chih-Horng Chang, Hao-Yi Tsai | 2024-09-24 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 11929318 | Package structure and method of forming the same | Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |