Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2024-08-20 |
| 12058101 | Package structure and method of forming the same | Chen-Hua Yu, Hao-Yi Tsai, Yu-Feng Chen | 2024-08-06 |
| 12017342 | Robot gripper for moving wafer carriers and packing materials and method of operating the same | Chien-Fa Lee, Feng-Kuang Wu, FU-CHENG HUNG, Chi-Wei Chen | 2024-06-25 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2024-06-11 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chen-Cheng Kuo | 2024-04-16 |
| 11948862 | Package structures and method of forming the same | Chen-Hua Yu, Hao-Yi Tsai, Yu-Feng Chen | 2024-04-02 |