Issued Patents 2024
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002768 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2024-06-04 |
| 11996227 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2024-05-28 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11953740 | Package structure | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-09 |
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-02 |
| 11948862 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2024-04-02 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh +2 more | 2024-03-26 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2024-03-19 |
| 11935871 | Semiconductor package and method of fabricating the same | Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |
| 11923318 | Method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Tin-Hao Kuo | 2024-03-05 |
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2024-03-05 |
| 11916025 | Device die and method for fabricating the same | Shih-Wei Chen, Tzuan-Horng Liu, Chia-Hung Liu | 2024-02-27 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2024-02-06 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2024-02-06 |