HT

Hsien-Ming Tu

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Zhubeikou, TW: #100 of 193 inventorsTop 55%
Overall (2024): #440,218 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11923318 Method of manufacturing semiconductor package Tsung-Hsien Chiang, Hao-Yi Tsai, Tin-Hao Kuo 2024-03-05