Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2024-08-27 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2024-07-30 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +2 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng | 2024-06-11 |
| 11923349 | Semiconductor structures | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |