Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12144065 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chung-Shi Liu | 2024-11-12 |
| 12112986 | FinFET device and method | Kun-Mu Li, Heng-Wen Ting, Hsueh-Chang Sung, Yen-Ru Lee | 2024-10-08 |
| 12034061 | Method for forming semiconductor structure | Yen-Ru Lee, Hsueh-Chang Sung, Yee-Chia Yeo | 2024-07-09 |
| 11942550 | Nanosheet semiconductor device and method for manufacturing the same | Chien-Chang Su, Yan-Ting Lin, Bang-Ting Yan, Chih Teng HSU, Chih-Chiang Chang +3 more | 2024-03-26 |
| 11929398 | FinFET structure and method for manufacturing thereof | Chun Hsiung Tsai, Lai-Wan Chong, Kei-Wei Chen | 2024-03-12 |
| 11929401 | Method of forming a source/drain | Hsueh-Chang Sung, Yen-Ru Lee | 2024-03-12 |