Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12135454 | Structure and process for photonic packages | Chen-Hua Yu, Hsing-Kuo Hsia | 2024-11-05 |
| 12080638 | Semiconductor device and method for manufacturing the same | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Jiun Yi Wu, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12033898 | Method of fabricating a FinFET device | Joanna Chaw Yane Yin, Chi-Hsi Wu, Kuang-Hsin Chen | 2024-07-09 |
| 12027455 | Chip-on-wafer structure with Chiplet Interposer | Weiming Chris Chen, Shang-Yun Hou | 2024-07-02 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Hsien-Pin Hu, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |
| 11980015 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2024-05-07 |