Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159860 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Tsang-Jiuh Wu | 2024-12-03 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12142485 | Semiconductor structure and manufacturing method thereof | Hung-Pin Chang, Tsang-Jiuh Wu | 2024-11-12 |
| 12132016 | Bonding structures of integrated circuit devices and method forming the same | Chen-Yu Tsai, Ku-Feng Yang | 2024-10-29 |
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Chen-Hua Yu | 2024-09-10 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu, Chen-Hua Yu | 2024-08-27 |
| 12062640 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu | 2024-08-13 |
| 12051672 | Package structure and method of forming the same | Yi-Hsiu Chen, Ebin Liao, Hong-Ye Shih, Jia-Ling Ko | 2024-07-30 |
| 12015008 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Chen-Hua Yu | 2024-06-18 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Kuo-Chiang Ting, Hsien-Pin Hu, Chen-Hua Yu | 2024-05-28 |
| 11990430 | Bonding structures of integrated circuit devices and method forming the same | Chen-Yu Tsai, Ku-Feng Yang | 2024-05-21 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11948920 | Semiconductor device and method for manufacturing the same, and semiconductor package | I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin +1 more | 2024-04-02 |
| 11869869 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Ku-Feng Yang, Ming-Tsu Chung | 2024-01-09 |