Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131954 | Selective epitaxy process for the formation of CFET local interconnection | Che Chi Shih, Hsin Yang Hung, Wei-Yen Woon, Szuya S. Liao | 2024-10-29 |
| 12132079 | Bonding and isolation techniques for stacked transistor structures | Kuan-Kan Hu, Han-De Chen, Chen-Fong Tsai, Chi On Chui, Szuya S. Liao | 2024-10-29 |
| 12132016 | Bonding structures of integrated circuit devices and method forming the same | Chen-Yu Tsai, Wen-Chih Chiou | 2024-10-29 |
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2024-09-10 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2024-08-27 |
| 11990430 | Bonding structures of integrated circuit devices and method forming the same | Chen-Yu Tsai, Wen-Chih Chiou | 2024-05-21 |
| 11869869 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Wen-Chih Chiou, Ming-Tsu Chung | 2024-01-09 |