Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132079 | Bonding and isolation techniques for stacked transistor structures | Kuan-Kan Hu, Han-De Chen, Ku-Feng Yang, Chi On Chui, Szuya S. Liao | 2024-10-29 |
| 12087592 | Ambient controlled two-step thermal treatment for spin-on coating layer planarization | Ya-Lun CHEN, Tsai-Yu Huang, Yahru Cheng, Huicheng Chang, Yee-Chia Yeo | 2024-09-10 |
| 12040382 | Method of forming a nano-FET semiconductor device | Li-Chi Yu, Cheng-I Chu, Yi-Rui Chen, Sen-Hong Syue, Wen-Kai Lin +3 more | 2024-07-16 |
| 11990404 | Heat dissipation for semiconductor devices and methods of manufacture | Cheng-I Chu, Jyh-Cherng Sheu, Huicheng Chang, Yee-Chia Yeo | 2024-05-21 |
| 11908708 | Laser de-bonding carriers and composite carriers thereof | Huicheng Chang, Jyh-Cherng Sheu, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2024-02-20 |
| 11901189 | Ambient controlled two-step thermal treatment for spin-on coating layer planarization | Ya-Lun CHEN, Tsai-Yu Huang, Yahru Cheng, Huicheng Chang, Yee-Chia Yeo | 2024-02-13 |