Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165888 | Method and system for bonding | Chieh Chang, Huicheng Chang, Yee-Chia Yeo | 2024-12-10 |
| 11990404 | Heat dissipation for semiconductor devices and methods of manufacture | Chen-Fong Tsai, Cheng-I Chu, Huicheng Chang, Yee-Chia Yeo | 2024-05-21 |
| 11955379 | Metal adhesion layer to promote metal plug adhesion | Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Yu-Sheng Wang, Ming-Hsing Tsai | 2024-04-09 |
| 11908708 | Laser de-bonding carriers and composite carriers thereof | Huicheng Chang, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2024-02-20 |
| 11894438 | Semiconductor device and manufacturing method thereof | Yee-Chia Yeo, Sung-Li Wang, Chi On Chui, Hung-Li Chiang, I-Sheng Chen | 2024-02-06 |