Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166078 | Contact structure for semiconductor device and method | Yan-Ming Tsai, Chih-Wei Chang, Sheng-Hsuan Lin, Hung-Hsu Chen, Wei-Yip Loh | 2024-12-10 |
| 12159837 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Syun-Ming Jang | 2024-12-03 |
| 12148659 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Wei-Jung Lin | 2024-11-19 |
| 12075709 | Tungsten via for a magnetic tunnel junction interconnect | Ya-Ling Lee, Wei-Gang Chiu | 2024-08-27 |
| 12020981 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Wei-Jung Lin | 2024-06-25 |
| 12002712 | Phase control in contact formation | Chun-Hsien Huang, I-Li Chen, Pin-Wen Chen, Yuan-Chen Hsu, Wei-Jung Lin +1 more | 2024-06-04 |
| 11955379 | Metal adhesion layer to promote metal plug adhesion | Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang | 2024-04-09 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more | 2024-03-12 |
| 11915976 | Semiconductor device pre-cleaning | Li-Wei Chu, Ying-Chi SU, Yu-Kai Chen, Wei-Yip Loh, Hung-Hsu Chen +1 more | 2024-02-27 |