YC

Yu-Syuan Cai

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #203,939 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11929314 Interconnect structures including a fin structure and a metal cap Chun-Hsien Huang, Peng-Fu Hsu, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang +4 more 2024-03-12