Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176435 | Method for forming fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contact | Chao-Hsun Wang, Kuo-Yi Chao, Rueijer Lin, Mei-Yun Wang | 2024-12-24 |
| 12166128 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2024-12-10 |
| 12159837 | Chemical direct pattern plating method | Wen-Jiun Liu, Hung-Wen Su, Ming-Hsing Tsai, Syun-Ming Jang | 2024-12-03 |
| 12142565 | Different via configurations for different via interface requirements | Shih-Che Lin, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +3 more | 2024-11-12 |
| 12068197 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chi-Cheng Hung, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai | 2024-08-20 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Ken-Yu Chang +4 more | 2024-03-12 |
| 11901426 | Forming metal contacts on metal gates | Chao-Hsun Wang, Yu-Feng Yin, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang | 2024-02-13 |