Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176435 | Method for forming fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contact | Chao-Hsun Wang, Kuo-Yi Chao, Chen-Yuan Kao, Mei-Yun Wang | 2024-12-24 |
| 12142565 | Different via configurations for different via interface requirements | Shih-Che Lin, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +3 more | 2024-11-12 |
| 11908697 | Interconnect structure having a carbon-containing barrier layer | Ya-Lien Lee, Chun-Chieh Lin, Hung-Wen Su | 2024-02-20 |