Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068194 | Selective deposition of metal barrier in damascene processes | Chia-Pang Kuo, Chieh-Yi Shen | 2024-08-20 |
| 11961761 | Mitigating pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen | 2024-04-16 |
| 11908697 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2024-02-20 |