Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12178817 | Compounds for enhancing PPARγ expression and nuclear translocation and therapeutic use thereof | Jen C. Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai, Ying-Chi Du | 2024-12-31 |
| 12172263 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2024-12-24 |
| 12170195 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang | 2024-12-17 |
| 12154515 | Displays with reduced temperature luminance sensitivity | Shinya Ono, Chin-Wei Lin, Zino Lee, Chen-Ming Chen | 2024-11-26 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh +4 more | 2024-09-17 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2024-09-03 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Wei-Wei Liang +7 more | 2024-06-04 |
| 11908697 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Hung-Wen Su | 2024-02-20 |