Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12082927 | Topical subcutaneous microcirculation detection device | Kang-Ping Lin, Shao-Hung Lu, Mei-Fen Chen | 2024-09-10 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2024-09-03 |