Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2024-09-03 |