Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng, Chih-Hsiang Chang +4 more | 2024-12-10 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh, Kai-Shiang Kuo +4 more | 2024-09-17 |