Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 12167611 | FeRAM MFM structure with selective electrode etch | Kuo-Chi Tu, Sheng-Hung Shih, Wen-Ting Chu, Tzu-Yu Chen, Fu-Chen Chang | 2024-12-10 |
| 12114509 | FeRAM decoupling capacitor | Tzu-Yu Chen, Kuo-Chi Tu, Fu-Chen Chang, Sheng-Hung Shih | 2024-10-08 |