Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Yen-Chun Lin, Hsin-Ying Peng, Chih-Hsiang Chang +4 more | 2024-12-10 |
CN
Chen-Yi Niu
Overall (2024): #508,285 of 561,600Top 95%
1
Patents 2024