Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng, Chih-Hsiang Chang +4 more | 2024-12-10 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Huei-Wen Hsieh, Kai-Shiang Kuo +4 more | 2024-09-17 |
| 11996361 | Method of making a contact structure | Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi, Chi-Feng Lin | 2024-05-28 |