Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094770 | Ruthenium-based liner for a copper interconnect | Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh, Kai-Shiang Kuo +4 more | 2024-09-17 |
| 11996361 | Method of making a contact structure | Shu-Cheng Chin, Hung-Wen Su, Chih-Chien Chi, Chi-Feng Lin | 2024-05-28 |